Amkor boosts Arizona’s manufacturing might

Amkor Technology is the world’s largest U.S.-headquartered provider of outsourced semiconductor assembly and test (OSAT). In early October, Amkor broke ground on a new $7 billion semiconductor advanced packaging and test facility in Peoria, Arizona. 

As the first U.S.-based high-volume advanced packaging facility, Amkor’s project is a critical part of Arizona’s growing semiconductor ecosystem, creating high-tech employment opportunities and enhancing economic vitality in the Phoenix metropolitan region and beyond. This campus will offer 750,000 square feet of cleanroom space and 3,000 high-wage jobs.

What they are saying:

  • Amkor’s decision to expand in Arizona underscores our state’s role as a global hub for advanced manufacturing and innovation. This project means thousands of new jobs, stronger supply chains, and a clear signal that Arizona is helping drive America’s semiconductor comeback. With investments like this, our state is proving we have the talent, infrastructure, and business climate to compete and win on the world stage.

    Danny Seiden

    President & CEO, Arizona Chamber of Commerce & Industry

  • Today’s groundbreaking of Amkor’s advanced packaging and test facility is a landmark moment across our region. This project will bring thousands of quality jobs and a multibillion-dollar investment to Peoria, all while strengthening our country’s critical semiconductor supply chain. Through Peoria’s strong partnership with Amkor we have been able to display all that is possible when private and public industry come together to execute on a shared vision for innovation and growth.

    Mayor Jason Beck

    City of Peoria

  • AI has ignited a new industrial revolution — and with it, the chance to reindustrialize America. Amkor’s new Arizona facility is a defining milestone in bringing this capability home. Together, we are rebuilding the supply chain — onshoring the AI technology stack that turns energy into intelligence and secures America’s leadership for the AI century.

    Jensen Huang

    Founder and CEO, NVIDIA

  • At Apple, we’re excited to help lead the creation of an end-to-end silicon supply chain in America. Factories across the United States are producing 19 billion chips for Apple this year alone, and Amkor’s new facility will package and test the Apple silicon produced at TSMC Arizona just down the road. We’re proud to invest in Amkor through Apple’s American Manufacturing Program, which is a key part of our $600 billion commitment to create jobs and accelerate innovation right here in the U.S.

    Sabih Khan

    Apple’s Chief Operating Officer

  • This new Amkor facility groundbreaking represents a testament to what is possible when industry leaders share a common vision and work together to build a resilient, end-to-end supply chain right here in the U.S. Our collaboration in Arizona will provide customers with a streamlined, domestic ecosystem, designed to help define the future of local semiconductor manufacturing.

    Jun He

    Vice President, Advanced Packaging Technology and Service at TSMC

  • Today’s Amkor groundbreaking represents a significant milestone in expanding U.S. capacity for advanced semiconductor packaging and test. By expanding its investment in Arizona, Amkor is creating jobs, fueling economic growth, and reinforcing American capabilities in a crucial stage of chip production. We commend Amkor for investing ambitiously in U.S.-based advanced packaging and test. We also applaud the Trump Administration for prioritizing the expansion of America’s semiconductor ecosystem and allowing America to do what it does best – compete and win globally.

    John Neuffer

    President & CEO, Semiconductor Industry Association

  • SEMI applauds Amkor’s Arizona investment. Advanced packaging is one of the most exciting technologies in the semiconductor market today and in the future, and this investment is a key element in the efforts to reshore semiconductor manufacturing in the United States. Amkor’s capabilities will serve as a cornerstone of America’s advanced packaging capabilities, supporting leading-edge device offerings.

    Joe Stockunas

    President, SEMI Americas